5 Sets of Dry ovens were ordered by malaysia customer for semiconductor material.
The dry oven is with working temp. 300C and the chamber size is 450*450*500mm.
FS Technology’s dry oven using hot air rising natural convection phenomenon, with no noise, less dust and slow airflow and other characteristics, suitable for drying, baking melting wax, sterilization, material processing, etc.
Our dry oven adopts mirror stainless steel inner liner, half-round arc transition corners and partition bracket can be freely switched to load and unload, easy to clean the chamber, the working temperature range of RT to 400 ℃, customers can choose according to their actual requirements.
2024/05/26 
